{"id":1948,"date":"2023-05-24T15:17:41","date_gmt":"2023-05-24T07:17:41","guid":{"rendered":"http:\/\/hce.pro.demo.coodemo.com\/?p=1948"},"modified":"2023-06-15T22:55:05","modified_gmt":"2023-06-15T14:55:05","slug":"intel-joins-with-eda-allies-for-on-demand-hardware-on-a-foundry-platform","status":"publish","type":"post","link":"https:\/\/www.hceics.com\/it\/intel-joins-with-eda-allies-for-on-demand-hardware-on-a-foundry-platform\/","title":{"rendered":"Intel Joins With EDA Allies for On-demand Hardware on a Foundry Platform"},"content":{"rendered":"

Intel\u00a0Foundry Services’ (IFS) Accelerator program is showing how\u00a0technology progresses\u00a0when small and big names join forces in partnerships.<\/p>\n

On June 28, 2022, IFS announced\u00a0a new program called\u00a0Cloud Alliance<\/a>\u00a0as part of its Accelerator program. Cloud Alliance is built to secure design environments in the cloud while streamlining design efficiency for foundry customers using on-demand compute. Some of the first members of Cloud Alliance include cloud providers Amazon Web Services and Microsoft Azure along with big names in\u00a0electronic design automation (EDA):\u00a0Ansys, Cadence, Siemens EDA, and Synopsys.<\/p>\n

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\"IFS\"<\/p>\n

The stated goal of IFS is\u00a0to become one of the world\u2019s leading foundries.<\/em><\/h5>\n
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The\u00a0IFS Accelerator program<\/a>\u00a0was previously built upon three key pillars\u2014EDA Alliance, IP Alliance, and Design Services Alliance\u2014to help small companies and startups access scalable chip manufacturing. Now, with a fourth pillar, Cloud Alliance,\u00a0small companies have a leg up on on-demand cloud design platforms\u00a0that would have been too expensive and slow to achieve independently.<\/p>\n

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Intel Foundry Services’ Accelerator Ecosystem<\/h3>\n

Because of the chip shortage, fabless chipmakers have\u00a0limited chip design resources<\/a>\u00a0to offer startups. Now, with Cloud Alliance, small companies that have relied on fabless design services can now get direct access to foundry manufacturing. This support includes not only foundry capabilities\u00a0but also tools to fully incorporate ideas in the design process and cut down time-to-market. Startups can even maximize all the benefits of ASIC design, for example.<\/p>\n

IFS Accelerator intends to bring\u00a0silicon products to market faster through company\u00a0collaborations. These partnerships pool resources, so small companies can access chip design hardware and software\u00a0on-demand, including EDA tools, silicon-verified intellectual property, and design services.<\/p>\n

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\"3D<\/p>\n

With the popularity of 3D packaging technology, chip architects are increasingly pushed toward\u00a0modular\u00a0designs, like “chiplets.”\u00a0\u00a0<\/em><\/h5>\n
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Such EDA tools help designers model system performance, estimate power needs, reduce chip manufacturing errors, and put logical ideas into computer form. IFS also aims to ease the burden of IP verification engineers, who must test system-on-a-chip (SoC) designs by accessing existing interfaces, memory, and protocol requirements. IFS’ reusable and integrated IP blocks can help shorten time-to-market for new silicon\u00a0products.<\/p>\n

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Phase One of IFS Accelerator<\/h3>\n

Intel rolled out the\u00a0preliminary phase of Accelerator<\/a>\u00a0back in September 2021. The core idea of this program was to provide advanced semiconductor manufacturing technologies to\u00a0automotive chipmakers<\/a>\u00a0who so desperately needed versatile, customized, and industry-standard\u00a0IP solutions. The openness and freedom of Intel’s IP framework could help these companies\u00a0practice innovation without risking IP confidentiality.<\/p>\n

Phase one was rolled out by 17 partnering companies involved in all three pillars of Accelerator, including:<\/p>\n