{"id":1969,"date":"2023-05-24T15:21:47","date_gmt":"2023-05-24T07:21:47","guid":{"rendered":"http:\/\/hce.pro.demo.coodemo.com\/?p=1969"},"modified":"2023-06-15T22:49:50","modified_gmt":"2023-06-15T14:49:50","slug":"intel-rethinks-a-common-substrate-to-combat-chip-shortage","status":"publish","type":"post","link":"https:\/\/www.hceics.com\/ja\/intel-rethinks-a-common-substrate-to-combat-chip-shortage\/","title":{"rendered":"Intel Rethinks a Common Substrate to Combat Chip Shortage"},"content":{"rendered":"

oday, the\u00a0continued chip shortage<\/a>\u00a0has caused\u00a0the cost of components to fluctuate wildly\u2014sometimes even in the span of 24 hours. These shortages have also given rise to a flood of counterfeit components known as the “gray market<\/a>.”<\/p>\n

Because Intel is one of the world’s top chipmakers, the company has been working behind the scenes to speed up manufacturing processes and revitalize the semiconductor supply chain at large.\u00a0This week, Intel recognized its\u00a0Vietnam site for easing supply chain shortages through a new initiative that\u00a0rethinks\u00a0Ajinomoto build-up films<\/a>\u00a0(ABF).<\/p>\n

 <\/p>\n

\"Intel<\/p>\n

Intel invested\u00a0$475 million in Intel Products Vietnam in January 2021. Image used courtesy of\u00a0Intel<\/a><\/em><\/h5>\n

 <\/p>\n

In this article, we\u2019ll discuss the ABF substrate, its impact on the supply chain, and how Intel\u2019s Vietnamese initiative is aiming to resolve market challenges.<\/p>\n

 <\/p>\n

What is an ABF Substrate?<\/h3>\n

One of the least glamorous, yet most important components to manufacture processing units is the\u00a0Aijnomoto build-up film (ABF) substrate<\/a>.<\/p>\n

Today, semiconductor-based processing units have become extremely complex and highly integrated in order to scale\u00a0down to nanometer processes. While this integration has been a significant boon for performance, it has also complicated the details of\u00a0interconnection. Interconnecting\u00a0electronics to the board and system level is more common\u00a0on the millimeter scale\u2014not\u00a0the nanometer scale.<\/p>\n

To accomplish such interconnections, almost all major semiconductor manufacturers employ an ABF.\u00a0The ABF acts as a bed within the device package\u00a0and consists of multiple layers of microcircuits that interface between the PCB and the nanoscale CPU.<\/p>\n

 <\/p>\n

\"An<\/p>\n

An ABF interfaces an IC and the PCB. Image used courtesy of\u00a0the\u00a0Ajinomoto Group<\/a><\/em><\/h5>\n

 <\/p>\n

The component takes its name from the Ajinomoto Group, which famously designs the thermosetting film that provides insulation to the processing unit. The film also exhibits important characteristics such as high durability and low thermal expansion.<\/p>\n

 <\/p>\n

ABF Decentralization<\/h3>\n

One of the major challenges plaguing the semiconductor industry is the acute shortage of ABF substrates. According to Intel, an added challenge of manufacturing ABF substrates is that these films are extremely decentralized.<\/p>\n

For example, a key element of the ABF substrate is capacitors, which are largely used for decoupling and occupy both sides of the substrate. However, Intel has historically attached capacitors to only one side of the substrate while relying on external suppliers to attach them to the other side.<\/p>\n

 <\/p>\n

\"A<\/p>\n

A lower level look at the ABF within a package. Image used courtesy of\u00a0the\u00a0Ajinomoto Group<\/a><\/em><\/h5>\n

 <\/p>\n

The result of this decentralized manufacturing is decreased time to market and increased productivity.<\/p>\n

 <\/p>\n

Intel\u2019s ABF Initiatives<\/h3>\n

Now, with ABF shortages\u00a0looming large, Intel is aiming to compensate by increasing the productivity of its existing ABF manufacturing processes.<\/p>\n

To do this Intel has announced that its Vietnam Assembly and Test (VNAT) factory will now\u00a0attach capacitors to both sides of the ABF substrate in-house. This change will allow Intel to effectively remove\u00a0a level of dependence on external suppliers during the ABF manufacturing process. The result, according to Intel, is the ability to complete chip assembly\u00a080% faster.<\/p>\n

Intel is offloading demand from the ABF suppliers by adding capacitors to both sides of ABF. In doing so, Intel hopes to not only improve its own manufacturing productivity but also help alleviate supply chain issues by letting ABF manufacturers focus on increasing their supply.<\/p>","protected":false},"excerpt":{"rendered":"

oday, the\u00a0continued chip shortage\u00a0has caused\u00a0the cost of components to fluctuate wildly\u2014sometimes even in the span of 24 hours. These shortages have also given rise to a flood of counterfeit components known as the “gray market.” Because Intel is one of the world’s top chipmakers, the company has been working behind the scenes to speed up manufacturing processes and revitalize the semiconductor supply chain at large.\u00a0This week, Intel recognized its\u00a0Vietnam site for easing supply chain shortages through a new initiative that\u00a0rethinks\u00a0Ajinomoto build-up films\u00a0(ABF).   Intel invested\u00a0$475 million in Intel Products Vietnam in January 2021. Image used courtesy of\u00a0Intel   In this article, we\u2019ll discuss the ABF substrate, its impact on the<\/p>","protected":false},"author":1,"featured_media":2042,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[1],"tags":[],"_links":{"self":[{"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/posts\/1969"}],"collection":[{"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/comments?post=1969"}],"version-history":[{"count":0,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/posts\/1969\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/media\/2042"}],"wp:attachment":[{"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/media?parent=1969"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/categories?post=1969"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.hceics.com\/ja\/wp-json\/wp\/v2\/tags?post=1969"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}